According to media reports, Samsung Electronics has sent a letter to customers notifying them that many DDR4 modules will reach the end of life (EOL) at the end of 2025, and the last order date is set for early June.

According to the supply chain, many Samsung 8GB, 16GB DDR4 SODIMM or UDIMM modules will be discontinued, and the last shipment date is set for December 10.

Products using 1y nanometer 16Gb DDR4 particles will be the first to face a significant reduction in supply. Although memory module manufacturers can still obtain some DDR4 particles from Samsung, the supply will continue to be tight.

Samsung is also accelerating the transfer of resources to high-end products such as DDR5 and LPDDR5. The output of the old 1y nanometer process will be greatly reduced. This shift will drive PC OEMs to accelerate the upgrade to DDR5.

From the perspective of product planning, the 1y nanometer process will be rapidly reduced in 2025, and the 1z nanometer process DDR4 will enter the EOL countdown in 2026. It is expected that by 2027, DDR4 particles will only maintain the supply of 1z nanometer process and eventually stop production.

In terms of supply strategy, DDR5 modules using 1a and 1b nanometer processes will be supplied to PC OEM customers such as Dell, HP, Asus, and Acer, while DDR4 particles using old processes will continue to be supplied to consumer or memory module customers.

In addition to Samsung, other memory manufacturers are also adjusting their strategies.

Micron has previously sent a letter notifying that it will stop producing old process DDR4 module products for server applications, but other DDR4 products will still be supplied. SK Hynix has also been reported to reduce the proportion of DDR4 production to 20%, but the final production suspension plan has not yet been determined.